Determination of Hydrogen Peroxide in CMP Slurry
In semiconductor manufacturing, accurate measurement of hydrogen peroxide (H₂O₂) in chemical mechanical polishing (CMP) slurry is essential for maintaining quality in resin production. Using the COM-A19 Automatic Titrator, measurements can be performed quickly and automatically with high reproducibility.
Key Highlights
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Real-time titration curve display
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Automatic measurement with optional sample changer
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Expandable configuration with additional burets and dispensers
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High throughput for frequent, automated testing
Application Details
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Reagents: 0.1 mol/L cerium sulfate standard solution (f = 1.005), 10% sulfuric acid solution as pH adjuster
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Sample: CMP slurry containing hydrogen peroxide
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Method: Automated titration with acid/salt titration function
Result
Reliable, repeatable peroxide quantification ensures consistent slurry quality for semiconductor polishing processes.
Download Application Note
[Hydrogen Peroxide in CMP Slurry – PDF Download]
Related Instrument: COM-A19 Automatic Titrator
