Fractional determination of acetic acid and ammonium acetate | Autotitrator COM-A19 - JM Science

Fractional Determination of Acetic Acid and Ammonium Acetate Using Automated Titration

Application Notes

Simultaneous determination of acetic acid and ammonium acetate using automated titration. Improve process control in semiconductor and industrial applications.

Boric Acid Analysis in Nickel Plating Baths Using Potentiometric Titration

Boric Acid Analysis in Nickel Plating Baths Using Potentiometric Titration

Application Notes

Boric acid is a critical buffer in nickel plating baths. Learn how automated potentiometric titration with mannitol improves accuracy, repeatability, and process control.

Determination of copper in copper sulfate plating solution | Autotitrator COM-A19 - JM Science

Copper Analysis in Copper Sulfate Plating Baths Using Redox Titration

Application Notes

Copper concentration is critical to plating performance and coating quality. Learn how automated redox titration improves accuracy, repeatability, and process control in copper sulfate baths.

Quantitative determination of total nickel (Ni²⁺) in nickel plating solution | Autotitrator COM-A19 - JM Science

Nickel (Ni²⁺) Analysis in Nickel Plating Baths Using EDTA Titration

Application Notes

Nickel concentration is the most critical parameter in plating bath control. Learn how automated EDTA titration improves accuracy, repeatability, and coating consistency.

Determination of hydrogen peroxide and sulfuric acid in etching solution | Autotitrator COM-A19 - JM Science

Determination of hydrogen peroxide and sulfuric acid in etching solution | Autotitrator COM-A19

Hiranuma Aquacounter Autotitrator COM-A19
Sulfuric acid and hydrogen peroxide are main components of the etching solution which is used for cleaning the copper surface (soft etching) or half etching. The concentration of sulfuric acid and hydrogen peroxide have to be properly controlled to maintain constant etching speed because hydrogen peroxide readily decomposes by itself. This report introduces a measurement example as below.
 1) Determination of sulfuric acid by neutralization titration with sodium hydroxide・・・(1)
 2) Determination of hydrogen peroxide by redox titration with potassium permanganate standard solution.・・・ (2)
H₂SO₄ + 2NaOH → Na₂SO₄ + H₂O・・・(1)
5H₂O₂ + 2KMnO₄ + 3H₂SO₄ → K₂SO₄ + 2MnSO₄ + 8H₂O + 5O₂・・・(2)
Determination of Tin (Sn²⁺) in solder plating solution | Autotitrator COM-A19 - JM Science

Determination of Tin (Sn²⁺) in solder plating solution | Autotitrator COM-A19

Application Notes

Control active tin (Sn²⁺) levels in solder plating baths to improve coating quality and prevent oxidation-related process instability.

Quantitative determination of chromic anhydride and chromium (III) in chromium plating solution | Autotitrator COM-A19 - JM Science

Chromium (Cr⁶⁺ and Cr³⁺) Analysis in Plating Baths for Process and Environmental Control

Application Notes

Control hexavalent and trivalent chromium levels in plating baths to improve coating performance, reduce defects, and support environmental compliance.

Quantitative determination of nickel chloride in nickel plating solution | Autotitrator COM-A19 - JM Science

Nickel Chloride Analysis in Nickel Plating Baths for Process Control

Application Notes

Nickel chloride plays a critical role in plating bath conductivity and anode performance. Learn how accurate analysis improves process stability and coating quality.