Hydrogen Peroxide Determination in CMP Slurry

Accurate Process Control for Semiconductor Manufacturing

In semiconductor manufacturing, chemical mechanical planarization (CMP) relies on slurry chemistry to achieve ultra-flat wafer surfaces. Hydrogen peroxide (H2O2) plays a critical role in the chemical activity of CMP slurries and must be carefully monitored to maintain consistent polishing performance.


⚠️ Why Hydrogen Peroxide Monitoring Matters

Hydrogen peroxide gradually decomposes over time, leading to changes in slurry behavior. Variations in H2O2 concentration can result in:

  • Inconsistent polishing rates
  • Surface defects and variability
  • Reduced process stability
  • Lower production yield

Routine and accurate measurement of hydrogen peroxide is essential to ensure stable CMP performance and reliable semiconductor manufacturing processes.


✅ Analytical Method

Hydrogen peroxide in CMP slurry can be determined using titration with a cerium sulfate standard solution under acidic conditions.

  • Titrant: 0.1 mol/L Ce(SO4)2
  • pH Adjustment: Sulfuric acid (H2SO4)

This method provides reliable and repeatable results suitable for routine quality control and process monitoring.


⚙️ Measurement Workflow

  1. Sample collection
  2. Add water
  3. Add sulfuric acid
  4. Automatic titration

The procedure is simple, fast, and highly reproducible, minimizing operator variability and supporting consistent laboratory operation.


📊 Performance Characteristics

  • High precision titration
  • Excellent repeatability
  • Suitable for routine semiconductor QC environments

Titration-based determination provides stable and consistent results for monitoring hydrogen peroxide concentration in CMP slurry systems.


⚙️ Recommended Instrumentation

COM-A19 Auto-Titrator

  • Flexible configuration
  • Large touch display
  • Expandable with sample changers and additional burets

COM-28 / COM-28S

  • Cost-effective entry model
  • Reliable for routine analysis
  • Simple operation for QC laboratories

🔁 Scalable for Production Environments

Hiranuma auto-titrators support high-throughput laboratory workflows, including automated sample handling and multi-sample measurement.

  • Compatible with multi-position sample changers
  • Supports routine QC and production monitoring
  • Designed for consistent, repeatable operation

🏭 Semiconductor Application

Hydrogen peroxide determination in CMP slurry is a key parameter in semiconductor process control. Maintaining consistent H2O2 concentration supports predictable polishing behavior and stable manufacturing performance.

Titration provides a reliable and practical approach for routine monitoring in semiconductor fabrication environments.

Looking for broader semiconductor process analysis solutions?
👉 Explore our Semiconductor Process Analysis page


📩 Learn More

Contact JM Science for additional application data or to discuss your semiconductor analysis requirements.

Contact JM Science